View TDA9178_819757.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA9178 YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
Preliminary specification File under Integrated Circuits, IC02 1999 Sep 24
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
FEATURES * Picture content dependent non-linear Y, U and V processing by luminance histogram analysis * Variable gamma control * Adaptive black and white stretch control * Skin tone correction * Green enhancement * Blue stretch * Luminance Transient Improvement (LTI) * Smart peaking for detail enhancement * Colour Transient Improvement (CTI) * SCAn VElocity Modulation (SCAVEM) output * Line Width Control (LWC) * Video Dependent Coring (VDC) * Colour Dependent Sharpness (CDS) * Noise measurement * Feature Mode (FM) detector * Cue Flash (CF) detector * Three additional pins for access to 6-bit ADC and I2C-bus * Adjustable chrominance delay * TV standard independent * I2C-bus controlled * 1fH and 2fH * DEmonstration MOde (DEMO). GENERAL DESCRIPTION The TDA9178 is a transparent analog video processor with YUV input and output interfaces. It offers three main functions: luminance vector processing, colour vector processing and spectral processing. Beside these three main functions, there are some additional functions. In the luminance vector processor, the luminance transfer function is controlled in a non-linear way by the distribution, in 5 discrete histogram sections, of the luminance values measured in a picture. As a result, the contrast ratio of the most important parts of the scene will be improved. Black restoration is available in the event of a set-up in the luminance signal. A variable gamma function, after the histogram conversion, offers the possibilities of alternative brightness control or factory adjustment of the picture tube.
TDA9178
The adaptive black stretch function of the TDA9178 offers the possibility of having a larger `weight' for the black parts of the video signal; the white stretch function offers an additional overall gain for increased light production. To maintain a proper colour reproduction, the saturation of the U- and V-colour difference signals is also controlled as a function of the actual non-linearity in the luminance channel. In the colour vector processor, the dynamic skin tone correction locally changes the hue of colours that match skin tones to the correct hue. The green enhancement circuit activates medium saturated green towards to more saturated green. The blue stretch circuit can be activated which shifts colours near white towards blue. The spectral processor provides 1D luminance transient improvement, luminance detail enhancement by smart peaking and a 1 D colour transient improvement. The TDA9178 can be used as a cost effective alternative to (but also in combination with) scan velocity modulation. In the spectral processor line width control (or aperture control) can be user defined. The TDA9178 is capable of adjusting the amount of coring according to the video level with the video dependent coring. The TDA9178 is also capable to give extra sharpness in the cases of saturated red and magenta parts of the screen using the colour dependent sharpness feature. An embedded noise detector measures noise during the field retrace in parts which are expected to be free from video or text information. With the noise detector a variety of `smart noise control' architectures can be set up. A feature mode detector is available for detecting signal sources like VCR (in still picture mode) that re-insert the levels of the retrace part. For this kind of signals the noise measurement of the TDA9178 is not reliable. An output signal (on the I2C-bus and on a separate pin) is available that detects when the picture content has been changed significantly, called cue flash. An embedded 6-bit ADC can be used for interfacing three analog low frequency voltage signals (e.g. ambient light control or beam current voltage level) to the I2C-bus.
1999 Sep 24
2
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
TDA9178
In the demonstration mode all the features selected by the user are automatically toggled between on and off. The TDA9178 concept has a maximum flexibility which can be controlled by the embedded I2C-bus. The supply voltage is 8 V. The device is mounted in a 24-lead SDIP package, or in a 24-lead SO package. QUICK REFERENCE DATA SYMBOL VCC Vi(Y) Vi(UV) VFS(ADC) PARAMETER supply voltage luminance input voltage (excluding sync) AMS = 0 AMS = 1 UV input voltage full-scale ADC input voltage CONDITIONS MIN. 7.2 - - - - TYP. 8.0 0.315 1.0 - 2.0 MAX. 8.8 0.45 1.41 1.9 - UNIT V V V V V
ORDERING INFORMATION TYPE NUMBER TDA9178 TDA9178T PACKAGE NAME SDIP24 SO24 DESCRIPTION plastic shrink dual in-line package; 24 leads (400 mil) plastic small outline package; 24 leads; body width 7.5 mm VERSION SOT234-1 SOT137-1
1999 Sep 24
3
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1999 Sep 24
YIN UIN VIN 6 8 9 INPUT STAGE DECDIG VCC 15 20 18 SUPPLY 24 skin tone correction green enhancement blue stretch COLOUR PROCESSING 23 n.c. n.c.
BLOCK DIAGRAM
Philips Semiconductors
handbook, full pagewidth
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
n.c. 12
n.c. 13
21
luminance vector processing
spectral processing
SMART PEAKING
SOUT
Y U, V
LUMINANCE PROCESSING black stretch histogram processing gamma control
LUMINANCE TRANSIENT IMPROVEMENT VIDEO DEPENDENT CORING
+
OUTPUT STAGE
19 17 16
YOUT UOUT VOUT
colour vector processing
SATURATION CORRECTION
COLOUR DEPENDENT SHARPNESS
DELAY CONTROL
COLOUR TRANSIENT IMPROVEMENT
4
VEE
SC
1
WINDOW GENERATION
22 2 NOISE MEASURING ANALOG TO DIGITAL CONVERTER 3 4 5
CF n.c. ADEXT1 ADEXT2 ADEXT3
TP
10
CALIBRATE FEATURE MODE DETECTION
cue flash
ADR SDA SCL
7
Preliminary specification
14 11
I2C-BUS CONTROL
TDA9178
MGR897
Fig.1 Block diagram.
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
PINNING SYMBOL SC n.c. ADEXT1 ADEXT2 ADEXT3 YIN ADR UIN VIN TP SCL n.c. PIN 1 2 3 4 5 6 7 8 9 10 11 12 DESCRIPTION sandcastle input not connected ADC input 1 ADC input 2 ADC input 3 luminance input address selection input U signal input V signal input test pin serial clock input (I2C-bus) not connected SYMBOL n.c. SDA DECDIG VOUT UOUT VEE YOUT VCC SOUT CF n.c. n.c. PIN 13 14 15 16 17 18 19 20 21 22 23 24
TDA9178
DESCRIPTION not connected serial data input/output (I2C-bus) decoupling digital supply V signal output U signal output ground luminance output supply voltage SCAVEM output cue flash output not connected not connected
handbook, halfpage
handbook, halfpage
SC 1 n.c. 2 ADEXT1 3 ADEXT2 4 ADEXT3 5 YIN 6
24 n.c. 23 n.c. 22 CF 21 SOUT 20 VCC 19 YOUT
SC 1 n.c. 2 ADEXT1 3 ADEXT2 4 ADEXT3 5 YIN 6
24 n.c. 23 n.c. 22 CF 21 SOUT 20 VCC 19 YOUT
TDA9178
ADR 7 UIN 8 VIN 9 TP 10 SCL 11 n.c. 12
MGR898
TDA9178T
18 VEE 17 UOUT 16 VOUT 15 DECDIG 14 SDA 13 n.c. ADR 7 UIN 8 VIN 9 TP 10 SCL 11 n.c. 12
MGR899
18 VEE 17 UOUT 16 VOUT 15 DECDIG 14 SDA 13 n.c.
Fig.2 Pin configuration (SOT234-1).
Fig.3 Pin configuration (SOT137-1).
1999 Sep 24
5
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
FUNCTIONAL DESCRIPTION Y input selection and amplification The gain of the luminance input amplifier and output amplifier can be adjusted to signal amplitudes of 0.315 and 1.0 V typically (excluding sync) by I2C-bus bit AMS. The sync part is processed transparently to the output, independently of the feature settings. The Y, U and V input signals are clamped during the burstkey period, defined by the sandcastle reference and should be DC-coupled (the circuit uses internal clamp capacitors). During the clamp pulse (see Figs 7, 8, 9 and 10) an artificial black level is inserted in the Y input signal to correctly preset the internal circuitry. Luminance vector processor In the luminance vector processor the transfer is controlled by a black stretch, the histogram processing and a gamma control circuit. The luminance vector processor also creates the cue flash signal. BLACK STRETCH A black detector measures and stores the level of the most black part of the scene within an internal defined fixed window in each field into a time constant. The time constant and the response time of the loop are internally fixed. Any difference between this value and the value measured during the clamp is regarded as black offset. In a closed loop offsets until a predefined value of the fullscale value are fed back to the input stage for compensation. The loop gain is a function of the histogram and variable gamma settings. The black offset correction can be switched on and off by the I2C-bus bit BON. Related to the corrected black offset the nominal signal amplitude is set again to 100% full scale through an amplitude stretch function. Luminance values beyond full scale are unaffected. Additionally, the measured black offset is also used to set the adaptive black stretch gain (see also Section "Adaptive black stretch"). HISTOGRAM PROCESSING For the luminance signal the histogram distribution is measured in real-time over five segments within an internally defined fixed window in each field. During the period that the luminance is in one segment, a corresponding internal capacitor is loaded by a current source. At the end of the field five segment voltages are stored into on-board memories. The voltages stored in the memories determine the non-linear processing of the luminance signal to achieve a picture with a maximum of information (visible details). 1999 Sep 24 6
TDA9178
Each field the capacitors are discharged and the measurement starts all over again. Parts in the scene that do not contribute to the information in that scene, like sub or side titles, should be omitted from the histogram measurement. No measurements are performed outside the internal fixed window period. Very rapid picture changes, also related to the field interlace, can result in flicker effects. The histogram values are averaged at the field rate thus cancelling the flicker effects.
Adaptive black stretch
The so-called adaptive black stretch gain is one of the factors that control the gamma of the picture. This gain is controlled by the measured black offset value in the black stretch circuit and the I2C-bus adaptive black stretch DAC: bits BT5 to BT0. For pictures with no black offset the black stretch gain equals unity so the gamma is not changed and the DAC setting has no influence. In case of a black offset, the black stretch gain is increased so the gamma of the picture is reduced. This procedure results in a maximum of visible details over the whole range of luminances. However, depending on personal taste, sometimes higher values of gamma are preferred. Therefore the amount of gamma reduction can be adjusted by the DAC.
Adaptive white-point stretching
For pictures with many details in white parts, the histogram conversion procedure makes a transfer with large gain in the white parts. The amount of light coming out of the scene is reduced accordingly. The white stretcher introduces additional overall gain for increased light production, and so violating the principle of having a full-scale reference. The white-point stretching can be switched on or off by means of the I2C-bus bit WPO.
Standard deviation
For scenes in which segments of the histogram distribution are very dominant with respect to the others, the non-linear amplification should be reduced in comparison to scenes with a flat histogram distribution. The standard deviation detector measures the spread of the histogram distribution and modulates the user setting of the non-linear amplifier.
Non-linear amplifier
The stored segment voltages determine the individual gain of each segment in such a way that continuity is granted for the complete luminance range.
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
The maximum and minimum gain of each segment is limited. Apart from the adaptive white-point stretching the black and white references are not affected by the non-linear processing. The amount of non-linearity can be controlled by the I2C-bus non-linearity DAC: bits NL5 to NL0. VARIABLE GAMMA On top of the histogram conversion a variable gamma function is applied for an alternative brightness control, or for factory adjustment. It is intended as an alternative for the DC-offset of the classic brightness user control. It maintains the black and white references. The gamma ranges from 0.5 to 1.5. The gamma can be set by the I2C-bus variable gamma DAC: bits VG5 to VG0. CUE FLASH In the present TV environment there is a lot of measured information like ambient light and noise. This information can be used to make an update of settings of the several algorithms after a picture has changed. The cue flash signal detects when a picture changes significantly. When the picture content has changed, the I2C-bus bit CF is set to logic 1 in the status register. After reading the status register, bit CF is reset to logic 0. On the output pin CF the cue flash information is present (active LOW) for only one line in the vertical retrace part. This pin is configured as an open drain output and therefore should be pulled up to the 5 V supply. Spectral processor In the spectral processor the luminance transfer is controlled by smart peaking, colour dependent sharpness and luminance transient improvement, defined by the sharpness improvement processor. The colour transfer is controlled by a colour transient improvement circuit; an additional output is available to provide a SCAVEM circuit. ADJUSTABLE CHROMINANCE DELAY The colour vector processor drives a delay line for correcting delay errors between the luminance input signal and the chrominance input signals (U and V). The chrominance delay can be adjusted in 6 steps of 12 ns (1fH) or 6 ns (2fH) by the I2C-bus bits CD2 to CD0. SHARPNESS IMPROVEMENT PROCESSOR The sharpness improvement processor increases the slope of large luminance transients of vertical objects and enhances transients of details in natural scenes by contour correction. 1999 Sep 24 7
TDA9178
It comprises three main processing units: the step improvement processor, the contour processor and the smart sharpness controller.
Transient improvement processor
The step improvement processor (see Fig.11) comprises two main functions: * MINMAX generator * MINMAX fader. The MINMAX generator utilizes all taps of an embedded luminance delay line to calculate the minimum and maximum envelope of all signals momentarily stored in the delay line. The MINMAX fader chooses between the minimum and maximum envelopes, depending on the polarity of a decision signal derived from the contour processor. Figures 12, 13 and 14 show some waveforms of the step improvement processor and illustrate that fast transients result with this algorithm. The MINMAX generator also outputs a signal that represents the momentary envelope of the luminance input signal. This envelope information is used by the smart sharpness controller. Line width control (also called aperture control) can be performed by I2C-bus line width DAC: bits LW5 to LW0. This control can be used to compensate for horizontal geometry errors caused by the gamma, for blooming of the spot of the CRT, or for compensating SCAVEM.
Contour processor
The contour processor comprises two contour generators with different frequency characteristics. The contour generator generates a second-order derivative of the incoming luminance signal which is supplied to the smart sharpness controller. In the smart sharpness controller, this signal is added to the properly delayed original luminance input signal, making up the peaking signal for detail enhancement. The peaking path features a low peaking frequency of 2 MHz (at 1fH), or a high peaking frequency of 3 MHz (at 1fH), selectable by I2C-bus bit CFS. The contour generators utilize three taps of the embedded luminance delay line. Figure 15 illustrates the normalized frequency transfer of the filter.
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
Smart sharpness controller
The smart sharpness controller (see Fig.16) is a fader circuit that fades between peaked luminance and step-improved luminance, controlled by the output of a step discriminating device known as the step detector. It also contains a variable coring level stage. The step detector is basically a differentiator, so both amplitude of the step and its slope add to the detection criterion. The smart sharpness controller has four user controls: * Steepness control, performed by the I2C-bus DAC: bits SP5 to SP0 * Peaking control, performed by the bits PK5 to PK0 I2C-bus DAC:
TDA9178
The smart peaking algorithm has been designed such that the luminance output amplitude will never exceed 110% of the luminance input signal amplitude. Therefore the normal peaking range (12 dB) will be reduced at large transients, and in case of colour dependent sharpness there is even more reduction. However, by setting bit OSP (Overrule Smart Peaking) one can undo the extra peaking reduction in case of colour dependant sharpness. It must be emphasized that setting OSP may lead to unwanted large luminance output signals, for instance in details in red coloured objects. COLOUR TRANSIENT IMPROVEMENT The colour transient improvement circuit (see Fig.17) increases the slope of the colour transients of vertical objects. Each channel of the CTI circuit basically consists of two delay cells: an electronic potentiometer and an edge detector circuit that controls the wiper position of the potentiometer. Normally the wiper of the potentiometer will be in position B (mid position), so passing the input signal B to the output with a single delay. The control signal is obtained by the signals A and C. When an edge occurs the value of the control signal will fade between +1 and -1 and finally will become zero again. A control signal value of +1 fades the wiper in position C, passing the two times delayed input signal to the output. A control signal of -1 fades the wiper in position A, so an undelayed input signal is passed to the output. The result is an output signal which has steeper edges than the input signal. Contrary to other existing CTI algorithms, the transients remain time correct with respect to the luminance signal, as the algorithm steepens edges proportionally, without discontinuity. SCAVEM A luminance output is available for SCAVEM processing. This luminance signal is not affected by the spectral processing functions. Colour vector processor The colour processing part contains skin tone correction, green enhancement and blue stretch. The colour vector processing is dependent on the amplitude and sign of the colour difference signals. Therefore, both the polarity and the nominal amplitude of the colour difference signals are relevant when using the colour vector processor facility.
* Video dependent coring, switched on or switched off by the I2C-bus bit VDC * Coring level control, performed by the I2C-bus DAC: bits CR5 to CR0. The steepness setting controls the amount of steepness in the edge-correction processing path. The peaking setting controls the amount of contour correction for proper detail enhancement. The envelope signal generated by the step improvement processor modulates the peaking setting in order to reduce the amount of peaking for large sine wave excursions. With video dependent coring, it is possible to have more reduction of the peaking in the black parts of a scene than in the white parts, and therefore automatically reducing the visibility of the background noise. The coring setting controls the coring level in the peaking path for rejection of high-frequency noise. All four settings facilitate reduction of the impact of the sharpness features, e.g. for noisy luminance signals. COLOUR DEPENDENT SHARPNESS The colour dependent sharpness circuit increases the luminance sharpness in saturated red and magenta parts of the screen. Because of the limited bandwidth of the colour signals, there is no need to increase the high frequencies of the colour signals. Instead, the details in the luminance signal will be enhanced. In this circuit a limited number of colours are enhanced (red and magenta). Contrary to normal peaking algorithm, extra gain is applied for low frequencies (2 MHz at 1fH). This is needed, because the information that is lacking below 2 MHz (at 1fH) is most important. In large coloured parts the normal peaking is still active to enhance the fine details.
1999 Sep 24
8
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
SKIN TONE CORRECTION Skin tones are very sensitive for transmission (hue) errors, because we have an absolute feeling for skin tones. To make a picture look free of hue error, the goal is to make sure that skin tones are put at a correct colour. The dynamic skin tone correction circuit achieves this goal by instantaneously and locally changing the hue of those colours which are located in the area in the UV plane that matches skin tones (see Fig.4). The correction is dependent on luminance, saturation and distance to the preferred axis and can be done towards two different angles. The preferred angle can be chosen by bit ASK in the I2C-bus settings. The settings are 123 (ASK = 0) and 117 (ASK = 1). The enclosed correction area can be increased to 140% with the I2C-bus bit SSK (so-called: Size). The enclosed detection `angle' of the correcting area can be increased to 160% with the I2C-bus bit WSK (so-called: Width). The skin tone correction can be switched on or off with the I2C-bus bit DSK. GREEN ENHANCEMENT The green enhancement circuit (see Fig.5) is intended to shift low saturated green colours towards more saturated green colours. This shift is achieved by instantaneously and locally changing those colours which are located in the area in the UV plane that matches low saturated green. The saturation shift is dependent on the luminance, saturation and distance to the detection axis of 208. The direction of shift in the colour is fixed by hardware. The amount of green enhancement can be increased to 160% by the I2C-bus bit GGR. The enclosed detection `angle' of the correcting area can be increased to 160% with the I2C-bus bit WGR (so-called: Width). The enclosed correction area can be increased to 140% with the I2C-bus bit SGR (so-called: Size). The green enhancement can be switched on or switched off with the I2C-bus bit DGR. BLUE STRETCH The blue stretch circuit (see Fig.6) is intended to shift colours near white towards more blueish coloured white to give a brighter impression. This shift is achieved by instantaneously and locally changing those colours which are located in the area in the UV plane that matches colours near white. The shift is dependent on the luminance and saturation. The direction of shift (towards an angle of 330) in the colour is fixed by hardware. The amount of blue stretch can be increased to 160% by the I2C-bus bit GBL.
TDA9178
The enclosed correction area can be increased to 140% by the I2C-bus bit SBL (so-called: Size). The blue stretch can be switched on or off by the I2C-bus bit DBL. SATURATION CORRECTION The non-linear luminance processing done by the histogram modification and variable gamma, influences the colour reproduction; mainly the colour saturation. Therefore, the U and V signals are linear processed for saturation compensation. Noise measuring A video line which is supposed to be free from video information (`empty line') is used to measure the amount of noise. The measured RMS value of the noise can be used for reducing several features, by the I2C-bus interface, such as luminance vector processing and spectral processing. For the TDA9178 the empty line is chosen three lines after recognition of the vertical blanking from the sandcastle pulse input. Figures 7, 8, 9 and 10 show the measurement locations for different broadcast norms. The noise detector is capable of measuring the signal-to-noise ratio between -45 and -20 dB. The output scale runs linearly with dB. The noise samples are averaged for over 20 fields to reduce the fluctuations in the measurement process. It is obvious, that for signal sources (like VCR in still picture mode) that re-insert the levels of the retrace part, the measurement is not reliable (see Section "Feature mode detector"). The result of the averaging process will update the contents of the I2C-bus register: bits ND5 to ND0 at a rate of 132 of the field frequency. If a register access conflict occurs, the data of the noise register is made invalid by setting the flag bit DV (Data Valid) to zero. Feature mode detector A detector is available for detecting signal sources (like VCR in still picture mode) that re-inserted the levels of the retrace part. For this kind of signals the noise measurement of the TDA9178 is not reliable, but this detector sets bit FM in the ND-register to logic 1. For normal video signals bit FM is set to logic 0. This circuit measures transients (like synchronization pulses) on the luminance input during the internal V-pulse. The feature mode detector is setting bit FM to logic 1 when no transients are present during 2 lines in the vertical retrace part over 3 fields (like the synchronization pulses).
1999 Sep 24
9
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
Successive approximation ADC Pins ADEXT1, ADEXT2 and ADEXT3 are connected to a 6-bit successive approximation ADC via a multiplexer. The multiplexer toggles between the inputs with each field. At each field flyback, a conversion is started for two of the three inputs and the result is stored in the corresponding bus register ADEXT1, ADEXT2 or ADEXT3. The input pin ADEXT1 is updated every field, while input fields ADEXT2 and ADEXT3 are updated once in two consecutive fields (see Figs 7, 8, 9 and 10). Once in 32 fields the ADEXT2 input is not updated, because then the noise measurement is updated. In this way, any slow varying analog signal can be given access to the I2C-bus. If a register access conflict occurs, the data of that register is made invalid by setting the flag bit DV (Data Valid) to zero. Smart noise control With the help of the internal noise detector and a user-preferred noise algorithm, the user can make a fully automatic I2C-bus feature reduction, briefly called `Smart Noise Control'. Demonstration mode By the I2C-bus bit DEM all the picture improvement features can be demonstrated in one picture. By setting bit DEM to logic 1, all the features selected by the user are active for 5 s in 1fH mode (in 2fH mode: 2.5 s), and for another 5 s in 1fH mode (in 2fH mode: 2.5 s) all features selected are turned off (then the TDA9178 is `transparent' to the incoming signal). Internal window To determine the histogram levels and the black offset the TDA9178 performs several measurements. An internally defined window serves to exclude parts in the scene like `subtitling' or `logos'. The internal window can be regarded as a weighting function which has a value of one within a square near the centre of the screen and which gradually decreases to zero towards the edges. When bit WLB (Window Letter Box) is made logic 1, the height of the window is reduced by a factor of 23. This prevents the contribution of the black bars above and below a 16 : 9 scene to the measurements. I2C-bus
TDA9178
The I2C-bus is always in standby mode and responds on a properly addressed command. Bit PDD (Power-Down Detected) in the status register is set each time an interruption of the power supply occurs and is reset only by reading the status register. A 3-bit identification code can also be read from the status register, which code can be used to automatically configure the application by software. The input control registers can be written sequentially by the I2C-bus by the embedded automatic subaddress increment feature or by addressing them directly. The output control functions cannot be addressed separately. Reading out the output control functions always starts at subaddress 00H and all subsequent words are read out by the automatic subaddress increment procedure. The bits in the I2C-bus are preset to logic 0 at power-on except for bits AMS and VG5: therefore the TDA9178 is in 1.0 V luminance signal range and the variable gamma is set to 20H (gamma correction 0%). I2C-BUS SPECIFICATION The slave address of the IC is given in Table "Slave address". If pin ADR of the TDA9178 is connected to ground, the I2C-bus address is 40H; if pin ADR is connected to pin DECDIG, the I2C-bus address is E0H. The circuit operates on clock frequencies up to 400 kHz. Slave address A6 ADR A5 1 A4 ADR A3 0 A2 0 A1 0 A0 0 R/W X
Auto-increment mode is available for subaddresses.
1999 Sep 24
10
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
Control functions DATA BYTE FUNCTIONS Inputs Control 1 Control 2 Control 3 Control 4 Adaptive black stretch Non-linearity amplifier Variable gamma Peaking Steepness Coring Line width Outputs Status Noise detection ADEXT1 (output) ADEXT2 (output) ADEXT3 (output) REG 00 01 02 03 04 X FM X X X X DV DV DV DV X ND5 AD5 AD5 AD5 CF ND4 AD4 AD4 AD4 ID2 ND3 AD3 AD3 AD3 ID1 ND2 AD2 AD2 AD2 DAC REG 00 01 02 03 04 05 06 07 08 09 0A DEM 0 SGR 0 0 0 0 0 0 0 0 VDC 0 WGR 0 0 0 0 0 0 0 0 WLB OSP GGR BON BT5 NL5 VG5 PK5 SP5 CR5 LW5 FHS WPO DGR CTI BT4 NL4 VG4 PK4 SP4 CR4 LW4 CFS 0 SSK CDS BT3 NL3 VG3 PK3 SP3 CR3 LW3 LDH CD2 WSK SBL BT2 NL2 VG2 PK2 SP2 CR2 LW2 TYPE SUBADDRESS D7 D6 D5 D4 D3 D2
TDA9178
D1
D0
0 CD1 ASK GBL BT1 NL1 VG1 PK1 SP1 CR1 LW1
AMS CD0 DSK DBL BT0 NL0 VG0 PK0 SP0 CR0 LW0
ID0 ND1 AD1 AD1 AD1
PDD ND0 AD0 AD0 AD0
1999 Sep 24
11
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
Input signals Table 1 Amplitude mode selection FUNCTION 0.315 V luminance (black to white) at YIN 1.0 V luminance (black to white) at YIN Luminance determined histogram FUNCTION histogram segments fixed histogram segments determined by peak white Contour filter selection FUNCTION peaking frequency is 2 MHz at 1fH or 4 MHz at 2fH peaking frequency is 3 MHz at 1fH or 6 MHz at 2fH Line frequency selection FUNCTION 1fH 2fH Window letterbox format FUNCTION normal internal window format `Letterbox' internal window format Video dependent coring on/off FUNCTION video dependent coring off video dependent coring on Demonstration mode on/off FUNCTION DEMO off DEMO on: auto-toggle selected features on/off (cycle is 10 s at 1fH or 5 s at 2fH) 1 Table 8 CD2 0 1 Table 9 Chrominance delay CD1 0 1 CD0 0 1
TDA9178
FUNCTION 40 ns at 1fH or 20 ns at 2fH -32 ns at 1fH or +16 ns at 2fH
AMS 0 1 Table 2
Overrule smart peaking FUNCTION smart peaking (maximum peaking reduced if Coxing) overrule smart peaking
OSP 0 LDH 0 1
Table 10 White-point stretch on/off WPO FUNCTION white-point stretch on white-point stretch off
Table 3 CFS 0 1
0 1
Table 11 Dynamic skin tone on/off DSK 0 1 skin tone off skin tone on FUNCTION
Table 4
FHS 0 1 Table 5
Table 12 Dynamic skin tone angle ASK 0 1 FUNCTION angle correction 123 angle correction 117
WLB 0 1 Table 6
Table 13 Dynamic skin tone width WSK 0 1 FUNCTION default detection angle 60% increased detection angle
VDC 0 1 Table 7
Table 14 Dynamic skin tone size SSK 0 1 default area 40% increased area FUNCTION
DEM 0 1
Table 15 Green enhancement on/off DGR 0 1 FUNCTION green enhancement off green enhancement on
1999 Sep 24
12
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
Table 16 Green enhancement gain GGR 0 1 FUNCTION default enhancement 60% increased gain
TDA9178
Table 24 Black offset compensation on/off BON 0 1 FUNCTION black offset compensation off black offset compensation on
Table 17 Green enhancement width WGR 0 1 FUNCTION default detection angle 60% increased detection angle
Table 25 Adaptive black stretch BT5 0 1 BT4 0 1 BT3 0 1 BT2 0 1 BT1 0 1 BT0 0 1 FUNCTION 0% 100%
Table 18 Green enhancement size SGR 0 1 default area 40% increased area FUNCTION
Table 26 Non-linearity amplifier NL5 0 1 NL4 0 1 NL3 0 1 NL2 0 1 NL1 0 1 NL0 0 1 FUNCTION 0% 100%
Table 19 Blue stretch on/off DBL 0 1 FUNCTION blue stretch off blue stretch on
Table 27 Variable gamma VG5 0 1 VG4 0 1 VG3 0 1 VG2 0 1 VG1 0 1 VG0 0 1 FUNCTION -100% 100%
Table 20 Blue stretch gain GBL 0 1 default gain 60% increased gain FUNCTION
Table 28 Peaking amplitude PK5 0 1 PK4 0 1 PK3 0 1 PK2 0 1 PK1 0 1 PK0 0 1 FUNCTION 0% 100%
Table 21 Blue stretch size SBL 0 1 default area 40% increased area FUNCTION
Table 29 Steepness correction SP5 0 1 SP4 0 1 SP3 0 1 SP2 0 1 SP1 0 1 SP0 0 1 FUNCTION 0% 100%
Table 22 Colour dependent sharpness on/off CDS 0 1 FUNCTION colour dependent sharpness off colour dependent sharpness on
Table 30 Coring level CR5 0 1 CR4 0 1 CR3 0 1 CR2 0 1 CR1 0 1 CR0 0 1 FUNCTION 0% 30%
Table 23 Colour transient improvement on/off CTI 0 1 FUNCTION colour transient improvement off colour transient improvement on
1999 Sep 24
13
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
Table 31 Line width correction LW5 LW4 LW3 LW2 LW1 LW0 0 0 0 0 0 0 FUNCTION 33% duty factor at 2 MHz sine wave/1fH 67% duty factor at 2 MHz sine wave/1fH Table 35 Noise detector ND5 0 1 ND4 0 1 ND3 0 1 ND2 0 1 ND1 0 1 ND0 0 1
TDA9178
FUNCTION -45 dB -20 dB
1
1
1
1
1
1
Table 36 ADEXT1, ADEXT2 and ADEXT3 AD5 0 AD4 0 1 AD3 0 1 AD2 0 1 AD1 0 1 AD0 0 1 FUNCTION external voltage = 0 V external voltage = 2 V
Output signals Table 32 Power-down detection PDD 0 1 FUNCTION no power-down detected since last read power-down detected 1
Table 37 Data valid bit of noise detector/ADEXT1, 2 and 3 registers DV FUNCTION data not valid because of possible register access collision data is valid
Table 33 Identification code ID2 0 ID1 1 ID0 0 FUNCTION TDA9178/N1
0 1
Table 34 Cue flash CF 0 1 FUNCTION no cue flash since last read cue flash detected
Table 38 Feature mode detector FM 0 1 FUNCTION normal video signal detected feature mode detected (noise detector is not reliable)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); all voltages referenced to ground. SYMBOL VCC Vn Tstg Tamb Tj HANDLING All pins are protected against ESD by means of internal clamping diodes. The protection circuit meets the following specification: Human body model: C = 100 pF; R = 1.5 k; all pins >3000 V Machine model: C = 200 pF; R = 0 ; all pins >200 V. At an ambient temperature of 90 C, all pins meet the following specification: Itrigger > 100 mA or Vpin > 1.5VCC(max) Itrigger < -100 mA or Vpin < -0.5VCC(max) 1999 Sep 24 14 supply voltage voltage on any pin storage temperature operating ambient temperature operating junction temperature PARAMETER MIN. -0.5 -0.5 -55 -10 - MAX. +8.8 VCC + 0.5 +150 +70 150 V V C C C UNIT
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient TDA9178 (SDIP24) TDA9178T (SO24) QUALITY SPECIFICATION In accordance with "SNW-FQ-611 part E". CHARACTERISTICS VCC = 8 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supply SUPPLY VOLTAGE (PIN VCC) VCC ICC supply voltage supply current 1fH mode 2fH mode DIGITAL SUPPLY DECOUPLING (PIN DECDIG) VDECDIG IDECDIG decoupling voltage decoupling load current - - 5 - - 1 7.2 - - 8.0 100 105 PARAMETER CONDITIONS MIN. TYP. CONDITIONS in free air 56 65 VALUE
TDA9178
UNIT K/W K/W
MAX.
UNIT
8.8 - -
V mA mA
V mA
Input and output selection LUMINANCE INPUT (PIN YIN) Vi(Y) Ii(bias)(Y) Vo(cl) GY(i-o) input voltage (excluding sync) input bias current AMS = 0 AMS = 1 no clamp LUMINANCE OUTPUT (PIN YOUT) output voltage level during clamping luminance gain input to output AMS = 1 AMS = 0 transparent at AMS = 1; at 1 V (p-p) transparent at AMS = 0; at 0.3 V (p-p) S/N(Y) BY signal-to-noise ratio of luminance output luminance bandwidth transparent 1fH mode (-1 dB); transparent 2fH mode (-1 dB); transparent Ebl black level error transparent - - 0.93 2.7 0.8 1.04 - - 1.15 V V - - - 0.315 1.0 - 0.45 1.41 0.1 V V A
0.96
1.07
1.18
52 5 6 -1.0
- - - 0
- - - +1.0
dB MHz MHz %
1999 Sep 24
15
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
SYMBOL Ro Io(bias) CL Vi(U)(p-p) Vi(V)(p-p) Ii(bias) Vo(cl) GUV(i-o) Eoffset Gtrack BUV PARAMETER output resistance output bias current load capacitance CONDITIONS - 1.3 - - - no clamp - - transparent transparent transparent 1fH mode; transparent (-3 dB) 2fH mode; transparent (-3 dB) Ro Io(bias) CL output resistance output bias current load capacitance 0.90 -1 - 2.5 5 - 1.3 - MIN. - - - 1.33 1.05 - 2.7 1.00 0 - - - - - - TYP. - 15
TDA9178
MAX. 150
UNIT mA pF
COLOUR DIFFERENCE INPUTS U AND V (PINS UIN AND VIN) input voltage U (peak-to-peak value) input voltage V (peak-to-peak value) input bias current 1.9 1.9 0.1 - 1.10 +1 5 - - 150 - 15 % % MHz MHz mA pF V V A V
COLOUR DIFFERENCE OUTPUTS U AND V (PINS UOUT AND VOUT) output voltage level during clamping gain inputs to output offset error UV gain tracking error bandwidth
Luminance vector processing BLACK STRETCH BLOScor(i) HISTOGRAM input black offset correction 8 10 12 %
White-point stretch
GWP(max) maximum luminance gain for white stretch maximum non-linearity setting gain - 1.1 -
Non-linear amplifier
Gnla(min) Gnla(max) Gnla Gg(var)(min)L Gg(var)(max) Gnla minimum segment gain maximum segment gain non-linear control curve maximum non-linearity setting gain maximum non-linearity setting gain 63 steps - - - - - 63 steps - 0.4 2.0 - - %
0 to 100 - 0.5 1.5 - -
VARIABLE GAMMA minimum variable gamma setting maximum variable gamma setting non-linear control curve
0 to 100 -
%
1999 Sep 24
16
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA9178
MAX.
UNIT
Colour vector processing SKIN TONE; note 1 and Fig.4 cor ap correction angle ASK = 0; DSK = 1 ASK = 1; DSK = 1 correction range (or aperture angle) DSK = 1; SSK = 1; WSK = 0 - - - 123 117 45 - - - deg deg deg
GREEN ENHANCEMENT; note 1 and Fig.5 cor ap correction angle DGR = 1 - - 208 45 - - deg deg correction range (or aperture angle) DGR = 1; SGR = 0; WGR = 0
BLUE STRETCH; note 2 and Fig.6 (str) stretch angle DBL = 1 - 330 - deg
Spectral processing GENERAL Qmax maximum contour amplitude at centre frequency note 3 - 12 - dB
Contour filter low frequency peaking
fpc(l) peaking centre frequency 1fH mode; CFS = 0 2fH mode; CFS = 0 - - - - - - - - - - - - - 2.0 4.0 - - - - - - MHz MHz
Contour filter high frequency peaking
fpc(h) peaking centre frequency 1fH mode; CFS = 1 2fH mode; CFS = 1 3.0 6.0 MHz MHz
Step detector
fdc PEAKING GPK CORING GCR tr(min) GSP tsd(max) GLW coring control curve 63 steps 0 to 45 - - % peaking control curve 63 steps 0 to 100 - % detection centre frequency 1fH mode 2fH mode 1.18 2.36 MHz MHz
LUMINANCE TRANSIENT IMPROVEMENT minimum rise time 10% to 90% steepness control curve note 4 63 steps 30 ns % 0 to 100 - 140 70 - -
Line width control
maximum step displacement 1fH mode 2fH mode line width control curve (duty factor) 63 steps at 1 MHz sine wave at 1fH ns ns %
33 to 67 -
1999 Sep 24
17
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
SYMBOL PARAMETER CONDITIONS - - - - MIN. TYP. - - - -
TDA9178
MAX.
UNIT
COLOUR TRANSIENT IMPROVEMENT tr(min) fpc Qmax SCAVEM SCAVEM OUTPUT (PIN SOUT) Vo(cl) GY BY Ro Io(bias) CL td(SOUT-YOUT) output voltage level during clamping gain luminance input to SCAVEM output bandwidth output resistance output bias current load capacitance delay w.r.t. YOUT 1fH mode (-1 dB) 2fH mode (-1 dB) - 0.93 5 6.0 - 0.8 - - 2.2 1.04 - - - - - -20 - 1.15 - - 150 - 15 - MHz MHz mA pF ns V minimum rise time 10% to 90% note 5 50 ns
COLOUR DEPENDENT SHARPNESS peaking centre frequency maximum contour amplitude at centre frequency 1fH mode 2fH mode note 3 2.0 4.0 6 MHz MHz dB
Successive approximation ADC ADC INPUTS (PINS ADEXT1, ADEXT2 VFS Ii(bias) RES DLE ILE fcon Qadt Timing SANDCASTLE INPUT (PIN SC) Ii(bias) Vsc(bn) Vsc(bc) tW(bk) tV Vbk(var)(p-p) input bias current detection level for blank detection level for clamp burst key pulse width vertical retrace time ripple on sandcastle burst key level (peak-to-peak value) 1fH mode 2fH mode no clamping - 0.9 - 1.8 0.9 6 - - 1.15 0.9Vtop - - - - 1 1.40 - - - - A V V s s lines input bias current data path resolution differential linearity error integral linearity error conversion frequency conversion time (video lines) ADEXT1 ADEXT2; ADEXT3 each channel
AND
ADEXT3) with respect to ground - - - - - - - - 2.0 - 6 - - 1fV 0.5fV 8 - 0.1 - 1 1 - - - V A bit LSB LSB Hz Hz lines
full-scale input voltage range
0.04Vtop V
1999 Sep 24
18
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
SYMBOL PARAMETER CONDITIONS - - -32 -16 -45 - MIN. TYP. - -
TDA9178
MAX.
UNIT
Overall output group delay performance td(YUV) tdm(UV-Y) input to output delay of YUV signals 1fH mode; transparent 2fH mode; transparent adjustment delay U and V signals w.r.t. Y signal 1fH mode; transparent 2fH mode; transparent see Figure 18 300 180 0 0 - 32fV ns ns ns ns
+40 +20 -20 -
Noise measurement Rnoise tcon Cue flash
CUE FLASH OUTPUT
range of noise detector conversion time
dB s
(PIN CF); OPEN COLLECTOR pull-up to external supply - - - - 5.5 1 V mA
Vo(max) Isink(max) Notes
maximum output voltage maximum sink current
1. The amount of correction depends on the parameters of the incoming YUV signals; therefore it is not possible to give exact figures for the correction angle. The aperture angle of the correction range of 45 (22.5) is just given as an indication and is valid for an input signal with a luminance signal amplitude of 75% and a colour saturation of 50%. 2. The amount of correction depends on the parameters of the incoming YUV signals; therefore it is not possible to give exact figures for the correction angle. 3. The contour signal cannot be measured separately from the luminance input signal. The contour signal is also processed by the smart noise controller. The frequency transfer in the peaking mode of the luminance signal can be derived from the frequency transfer of the selected contour signal, taking into account the summation of the contour signal and the luminance input signal. The frequency transfer is most easily measured by sine excitation with a relatively small signal amplitude of 10% of the selected dynamic range of the luminance input, to avoid interaction with the step detector. 4. Peaking set to minimum. Input signal is a sine wave with the nominal peak-to-peak amplitude corresponding to the selected input range. 5. Input signal is a 250 kHz block with a rise time of 260 ns and a nominal peak-to-peak amplitude corresponding to the selected input range.
1999 Sep 24
19
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
TDA9178
handbook, full pagewidth
red V
I-axis
fully saturated colours
yellow -U
MGR900
Fig.4 Skin tone correction range for a correction angle of 123.
handbook, full pagewidth
yellow -U
detection-axis
fully saturated colours -V green
MGR901
Fig.5 Green enhancement correction range.
1999 Sep 24
20
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
TDA9178
handbook, full pagewidth
U blue
detection-axis
fully saturated colours
-V cyan
MGR902
Fig.6 Blue stretch correction range.
1999 Sep 24
21
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1999 Sep 24
video input sandcastle input burst key pulse clamping pulse
Philips Semiconductors
NTSC-signal, field A
handbook, full pagewidth
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
22
internal V-pulse + FM detection
noise detector measuring
ADEXT1 conversion ADEXT2, ADEXT3 conversion cue flash output
MGR903
Preliminary specification
TDA9178
Fig.7 Timing pulses for NTSC input signal, field A.
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1999 Sep 24
video input sandcastle input burst key pulse clamping pulse
Philips Semiconductors
NTSC-signal, field B
handbook, full pagewidth
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
23
internal V-pulse + FM detection
noise detector measuring
ADEXT1 conversion ADEXT2, ADEXT3 conversion
Preliminary specification
cue flash output
MGR904
TDA9178
Fig.8 Timing pulses for NTSC input signal, field B.
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1999 Sep 24
video input sandcastle input burst key pulse clamping pulse
Philips Semiconductors
PAL-signal, field A
handbook, full pagewidth
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
24
internal V-pulse + FM detection noise detector measuring ADEXT1 conversion ADEXT2, ADEXT3 conversion cue flash output
MGR933
Preliminary specification
TDA9178
Fig.9 Timing pulses for PAL and SECAM input signal, field A.
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1999 Sep 24
video input sandcastle input burst key pulse clamping pulse
Philips Semiconductors
PAL-signal, field B
handbook, full pagewidth
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
25
internal V-pulse + FM detection noise detector measuring ADEXT1 conversion ADEXT2, ADEXT3 conversion cue flash output
MGR934
Preliminary specification
TDA9178
Fig.10 Timing pulses for PAL and SECAM input signal, field B.
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
TDA9178
handbook, full pagewidth
line width control
MINMAX SELECTOR
FADER
Ystep
Yin
DELAY
CLAMPS
MINMAX Yenvelope
MGR905
Fig.11 Block diagram of the step improvement processor.
handbook, halfpage
(1)
1000 Vo (mV) 800
MGR906
600
400
(2)
200
0 0 0.5 1.0 1.5 t (s) 2.0
(1) 90% of nominal amplitude. (2) 30% of nominal amplitude.
Fig.12 Response signals for maximum step improvement, no peaking and nominal line width.
1999 Sep 24
26
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
TDA9178
handbook, halfpage
(1)
1000 Vo (mV) 800
MGR907
600
400
200
(2)
0 0 0.5 1.0 1.5 t (s) 2.0
(1) 90% of nominal amplitude. (2) 30% of nominal amplitude.
Fig.13 Response signals for maximum step improvement, no peaking and minimum line width.
handbook, halfpage
(1)
1000 Vo (mV) 800
MGR908
600
400
(2)
200
0 0 0.5 1.0 1.5 t (s) 2.0
(1) 90% of nominal amplitude. (2) 30% of nominal amplitude.
Fig.14 Response signals for maximum step improvement, no peaking and maximum line width.
1999 Sep 24
27
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
TDA9178
handbook, halfpage
(1)
100 contour (%) 80
MGR909
60
(2)
40
20
0 105
106
f (Hz)
107
(1) 1fH mode. (2) 2fH mode.
Fig.15 Frequency transfers of contour filter at f = 2.0 MHz.
handbook, full pagewidth
coring control
delay cells
STEP DETECTOR
Yenvelope Ycontour Ystep CORING Yc FADER Ystep
peaking steepness control control
MGR910
Fig.16 Block diagram of smart sharpness controller.
1999 Sep 24
28
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
TDA9178
handbook, halfpage
UVin
DELAY A control BC
DELAY
MGR911
UVout
Fig.17 Block diagram of colour transient improvement.
handbook, halfpage
80
MGR912
DACvalue 60
40
20
0 -50
-40
-30
-20
S/N (dB)
-10
Fig.18 Typical noise measurement curve of input noise (dB) versus DAC-value.
1999 Sep 24
29
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
TEST AND APPLICATION INFORMATION
TDA9178
The TDA9178 is especially designed for YUV applications. A typical application diagram is shown in Fig.19.
handbook, full pagewidth
sandcastle
SC n.c.
1 2
24 23
n.c. n.c.
ADEXT1 100 k
ADEXT1
3
22 21
CF SOUT VCC 100 nF 10 F
CF SOUT 8V
ADEXT2 100 k ADEXT3 100 k
4 5
ADEXT2
20
ADEXT3 1 YIN 0 UIN
YIN ADR UIN VIN
6
19
YOUT VEE
YOUT 0V UOUT VOUT
TDA9178
7 18
8 9
17 16
UOUT VOUT DECDIG 100 nF SDA n.c.
VIN
TP 100 SCL
10
15
SCL n.c.
11 12
14 13
100 SDA
MGR913
Fig.19 YUV application.
1999 Sep 24
30
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
PACKAGE OUTLINES SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
TDA9178
SOT234-1
D seating plane
ME
A2
A
L
A1 c Z e b 24 13 b1 wM (e 1) MH
pin 1 index E
1
12
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 4.7 A1 min. 0.51 A2 max. 3.8 b 1.3 0.8 b1 0.53 0.40 c 0.32 0.23 D (1) 22.3 21.4 E (1) 9.1 8.7 e 1.778 e1 10.16 L 3.2 2.8 ME 10.7 10.2 MH 12.2 10.5 w 0.18 Z (1) max. 1.6
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT234-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1999 Sep 24
31
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
TDA9178
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Sep 24
32
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
TDA9178
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 33
1999 Sep 24
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
Suitability of IC packages for wave, reflow and dipping soldering methods
TDA9178
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
1999 Sep 24
34
Philips Semiconductors
Preliminary specification
YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA9178
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1999 Sep 24
35
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/01/pp36
Date of release: 1999
Sep 24
Document order number:
9397 750 04621

▲Up To Search▲

Price & Availability of TDA9178

	To Download TDA9178 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .